Computex 2026 Countdown. Jensen Huang and Lisa Su Gather in Taipei; AMD Concept Stock List Updated? Which Taiwan AI Supply Chain Stocks Benefit Most?

TradingKey - COMPUTEX 2026 (Taipei International Computer Show) is set to take place from June 2 to June 5, with the theme "AI Together." NVIDIA (NVDA) , AMD, and Intel (INTC) —all three AI chip giants will be participating.

According to a DIGITIMES report on Tuesday, NVIDIA CEO Jensen Huang arrived in Taiwan on May 23 and is expected to stay for more than 10 days, during which he will visit TSMC (TSM) founder Morris Chang, CEO C.C. Wei, and Quanta Chairman Barry Lam, among other industry figures. AMD CEO Lisa Su arrived in Taipei on May 20 and officially announced on the 21st that AMD will invest over $10 billion in Taiwan's industrial ecosystem, marking the company's largest commitment to the Taiwan supply chain to date.

What signals does the simultaneous visit of the three major AI chip giants to Taiwan send to the global AI industry chain? What collaborations will NVIDIA, AMD, and Intel finalize in Taiwan? Which Taiwan-listed stocks in the supply chain will benefit?

Taiwan's AI Supply Chain: Why Nvidia and AMD Are Competing for Production Capacity

Lisa Su stated that AMD's investment of more than $10 billion will be directed toward expanding strategic partnerships and boosting advanced packaging manufacturing capacity for next-generation AI infrastructure. She noted that AI infrastructure requires large-scale investment and a collective effort to advance the entire ecosystem. AMD is currently increasing capacity in areas such as wafers, advanced packaging, substrates, and rack-level systems. With Intel and Samsung both vying for AI foundry orders, Su positioned TSMC as AMD's primary partner.

Su revealed that she personally visited C.C. Wei and held meetings with several supply chain partners, including cloud IT infrastructure provider Wiwynn, contract manufacturing giant Quanta, and computer manufacturer Acer.

Intel plans to host a supply chain cocktail reception on June 1 for its long-term upstream and downstream partners. On June 2, it plans to hold closed-door exchanges with executives from the "Big Five" electronics contract manufacturers—Quanta, Wistron, Pegatron, Compal, and Inventec—as well as companies such as Asus and Advantech.

AMD Concept Stocks List: TSMC, ASE, Powertech

The intensive visits and increased investments in Taiwan by the three major AI chip giants have sent a clear signal: Taiwan is no longer just a foundry hub; its entire supply chain, from design and manufacturing to packaging, is attracting global attention.

The strategic business focus of these three companies in the near future will likely determine their supplier preferences.

AMD's strategic expansion in Taiwan has commenced, with a core strategy focused on building an industrial ecosystem for EFB (Elevated Fanout Bridge) 2.5D packaging technology. By partnering with Taiwan's specialized OSAT providers to jointly develop and validate EFB technologies and standards, AMD aims to boost overall industry capacity while lowering costs. As a result, Taiwanese firms that successfully collaborate with AMD to expand the EFB ecosystem stand to benefit significantly as winners.

According to the announcement, AMD is co-developing and validating next-generation wafer-based 2.5D bridge interconnect technology with ASE (3711) and has successfully validated the industry's first 2.5D panel-level EFB interconnect with Powertech Technology (6239). In the critical substrate technology segment, it will collaborate with Unimicron (3037), Nan Ya PCB (8046), and Kinsus (3189).

Additionally, attention should be given to Helios, a rack-level platform launched by AMD this year specifically for large-scale AI and high-performance computing (HPC). AMD will partner with ODMs including Sanmina, Wiwynn, Wistron, Inventec, and AIC to deploy the Helios platform in the second half of this year. With Helios entering mass production, these Taiwanese ODM manufacturers are expected to see a significant boost in order visibility for the latter half of the year.

Equally significant is the Venice server processor, the world's first HPC chip in the semiconductor industry to enter mass production using the 2nm process. According to AMD's announcement, the chip is currently undergoing a full capacity ramp-up at TSMC foundries, making TSMC a primary beneficiary.

Which Taiwanese stocks will benefit from NVIDIA's Vera Rubin and Intel's AI PCs?

NVIDIA recently introduced the Vera Rubin NVL72 platform, which utilizes TSMC's third-generation 3nm process and CoWoS-L packaging, supporting 8-layer HBM4 high-bandwidth memory for the first time. Analysts suggest that since a single Vera Rubin system contains nearly 2 million components, it could become one of the largest product generations in Taiwan's history, involving approximately 150 Taiwanese ecosystem partners. Consequently, every segment of the AI supply chain—including wafer foundries, advanced packaging, servers, thermal management, and power supplies—is expected to benefit.

Due to the increased complexity of the Rubin chip architecture, WinWay (6515), a supplier of high-end test sockets, and probe card leader MPI (6223) are poised to profit from NVIDIA's interface testing. Furthermore, as the power consumption of individual AI chips exceeds 1,200W, liquid cooling leaders Quanta (2382) and Gigabyte (2376) are likely to secure orders from NVIDIA.

Intel CEO Lip-Bu Tan's visit to Taiwan is aimed at reclaiming PC market share eroded by Qualcomm and AMD, potentially benefiting downstream AI PC firms such as ASUS (2357) and Acer (2353), as well as consumer PC contract manufacturers like Compal (2324) and Pegatron (4938).